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After plaguing electronic products for more than 10 years of high-calorie, high-energy, and high-carbon emissions, the three major problems have finally made breakthroughs. According to news from foreign media on February 8, Lenovo officially announced the "new low temperature solder paste (LTS) process" that will save up to 35% of carbon emissions, while also improving computer reliability.
The LTS process uses low-temperature soldering materials. The soldering temperature is only 180 degrees Celsius, which is about 70 degrees lower than the conventional method. This is equivalent to directly alleviate the high heat and energy consumption problems in the computer manufacturing process, and at the same time it also improves the reliability of the equipment. It is understood that this process also makes the warpage rate of printed circuit boards greatly reduced. By the end of 2018, Lenovo will use multiple processes to use this technology, and it is expected to reduce 5,956 tons of CO2 emissions each year.
The most important point of the LTS process is that while reducing carbon emissions, the cost will not increase because new materials or equipment are not needed. This means that ThinkPad E and fifth-generation X1 Carbon laptops built with this process will have improved equipment reliability, and the production process will be more environmentally friendly and prices will not increase.
Lenovo plans to promote the LTS process free of charge throughout the entire industry. This breakthrough technology will be widely used in all electronic industry manufacturing processes involving printed circuit boards, contributing to a low-carbon economy.
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